• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    A system for analyzing a state of a thermoset material is disclosed. In various embodiments, the system includes a source of electromagnetic energy configured to expose a sample of the thermoset material to an electric field; a detector configured to determine at least one of a dielectric permittivity or a complex admittance of the sample over a range of frequencies in response to a frequency sweep over the electric field; and an analyzer configured to assess the state of the thermoset material by comparing the at least one of the dielectric permittivity or the complex admittance of the sample against an acceptability map. In various embodiments, the acceptability map comprises a series of acceptability bands that represent a decrease in effective relaxation time from a baseline fresh batch of the thermoset material.
    公开号:EP3686582A1
    申请号:EP19216724.5
    申请日:2019-12-16
    公开日:2020-07-29
    发明作者:Haralambos Cordatos
    申请人:Rohr Inc；
    IPC主号:G01N27-00
    专利说明:
    [0001] The present disclosure relates generally to methods for determining a state of a material and, more particularly, to methods for determining a state of a resin. BACKGROUND
    [0002] Thermoset adhesives or resins used in the manufacture of composite structures are typically stored in cold environments (e.g., at or below -32°F or 0°C). The cold environments enable the internal structure and mechanical properties of such materials to maintain an integrity or suitability required for later use in the manufacture of the composite structures, at which time the materials are subjected to elevated temperatures necessary for curing. A shelf-life or expiration date of such materials is generally established based on an assumption that the materials will be stored at or below a specified temperature. Such time periods or dates, however, are typically arbitrary and overly conservative, leading to unnecessary disposal of otherwise satisfactory material (e.g., material having mechanical properties little changed from those of a fresh batch) merely because a shelf-life has expired or an expiration date has been reached. Methods and apparatus configured to rapidly and efficiently analyze the mechanical properties of thermoset adhesives or resins prior to or following an expiration date may provide substantial savings in the cost of replacing the materials and reductions in the premature disposal of otherwise acceptable quality materials.
    [0003] Methods capable of assessing the state of thermoset materials currently exist, but these methods involve extensive, time-consuming laboratory testing by specialists and are thus not practical for use in manufacturing settings. For example, spectroscopic techniques such as infrared and Raman spectroscopy may nowadays be easily implemented, even with hand-held instruments. These techniques, however, rely on the formation of enough new chemical bonds to exceed their detection limit; and given the complexity of industrially relevant thermoset matrices, resolution of multiple overlapping peaks would be required. Moreover, it is unclear how exactly one would correlate any detectable changes in chemical bonding to changes in rheological and mechanical properties-especially in a resin matrix system that may contain many different materials: fibers (carbon, glass or aramid) and a range of additives such as curing agents, accelerators or flame retardants. Therefore, it is unlikely that monitoring changes in chemical bond formation via molecular spectroscopy may be used alone to determine the point at which a material has reached an unacceptable state. Other techniques, such as HPLC (High-Performance Liquid Chromatography), especially when used in conjunction with methods that monitor changes in glass transition temperature and mechanical properties, may be used to qualify the material with reasonable certainty, because they essentially assess, rather than infer, its state. However, their practice is time-consuming and requires a laboratory setting and specialized skills.
    [0004] A practical approach to saving cost and reducing waste by preventing premature or unnecessary disposal of thermoset materials requires a simple-to-use technique that may be implemented quickly and accurately in a manufacturing environment. The following disclosure provides such an approach. SUMMARY
    [0005] A method of analyzing a state of a thermoset material is disclosed. In various embodiments, the method includes exposing a sample of the thermoset material to an electric field; performing a frequency sweep to determine at least one of a dielectric permittivity or a complex admittance of the sample over a range of frequencies; and assessing the state of the thermoset material by comparing the at least one of the dielectric permittivity or the complex admittance of the sample against an acceptability map.
    [0006] In various embodiments, the acceptability map comprises a series of acceptability bands. In various embodiments, the series of acceptability bands represents a decrease in effective relaxation time from a baseline fresh batch of the thermoset material. In various embodiments, the series of acceptability bands comprises a real part of the at least one of the dielectric permittivity or the complex admittance. In various embodiments, the series of acceptability bands comprises an imaginary part of the at least one of the dielectric permittivity or the complex admittance.
    [0007] In various embodiments, the electric field comprises a sinusoidal source signal. In various embodiments, the electric field comprises a pulse source signal. In various embodiments, the frequency sweep is performed at an isothermal condition. In various embodiments, the thermoset material is a prepreg material.
    [0008] A method for analyzing a state of a thermoset material via a processor is disclosed. In various embodiments, the method includes exposing, via an emitter, a sample of the thermoset material to an electric field, the emitter being controlled by the processor; performing, via a detector, a frequency sweep to determine at least one of a dielectric permittivity or a complex admittance of the sample over a range of frequencies, the detector being controlled by the processor; and assessing, via the processor, the state of the thermoset material by comparing the at least one of the dielectric permittivity or the complex admittance of the sample against an acceptability map.
    [0009] In various embodiments, the acceptability map comprises a series of acceptability bands. In various embodiments, the series of acceptability bands represents a decrease in effective relaxation time from a baseline fresh batch of the thermoset material. In various embodiments, the series of acceptability bands comprises a real part of the at least one of the dielectric permittivity or the complex admittance. In various embodiments, the series of acceptability bands comprises an imaginary part of the at least one of the dielectric permittivity or the complex admittance.
    [0010] In various embodiments, the electric field comprises a sinusoidal source signal. In various embodiments, the electric field comprises a pulse source signal. In various embodiments, the frequency sweep is performed at an isothermal condition. In various embodiments, the thermoset material is a prepreg material.
    [0011] A system for analyzing a state of a thermoset material is disclosed. In various embodiments, the system includes a source of electromagnetic energy configured to expose a sample of the thermoset material to an electric field; a detector configured to determine at least one of a dielectric permittivity or a complex admittance of the sample over a range of frequencies in response to a frequency sweep over the electric field; and an analyzer configured to assess the state of the thermoset material by comparing the at least one of the dielectric permittivity or the complex admittance of the sample against an acceptability map. In various embodiments, the acceptability map comprises a series of acceptability bands that represent a decrease in effective relaxation time from a baseline fresh batch of the thermoset material.
    [0012] The forgoing features and elements may be combined in any combination, without exclusivity, unless expressly indicated herein otherwise. These features and elements as well as the operation of the disclosed embodiments will become more apparent in light of the following description and accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS
    [0013] The subject matter of the present disclosure is particularly pointed out and distinctly claimed in the concluding portion of the specification. A more complete understanding of the present disclosure, however, may best be obtained by referring to the following detailed description and claims in connection with the following drawings. While the drawings illustrate various embodiments employing the principles described herein, the drawings do not limit the scope of the claims.FIG. 1 is a plot of isothermal complex dielectric function versus frequency obtained for two relaxation times based on the Havriliak-Negami model, in accordance with various embodiments; FIGS. 2A and 2B illustrate acceptability bands of a hypothetical thermoset based on changes in isothermal dielectric function signature, in accordance with various embodiments; FIGS. 3A and 3B illustrate acceptability bands of a hypothetical thermoset based on changes in isothermal complex conductivity signature, in accordance with various embodiments; FIG. 4 illustrates a system configured for analyzing a state of a thermoset material, in accordance with various embodiments; and FIG. 5 describes a method of analyzing a state of a thermoset material, in accordance with various embodiments. DETAILED DESCRIPTION
    [0014] The following detailed description of various embodiments herein makes reference to the accompanying drawings, which show various embodiments by way of illustration. While these various embodiments are described in sufficient detail to enable those skilled in the art to practice the disclosure, it should be understood that other embodiments may be realized and that changes may be made without departing from the scope of the disclosure. Thus, the detailed description herein is presented for purposes of illustration only and not of limitation. Furthermore, any reference to singular includes plural embodiments, and any reference to more than one component or step may include a singular embodiment or step. Also, any reference to attached, fixed, connected, or the like may include permanent, removable, temporary, partial, full or any other possible attachment option. Additionally, any reference to without contact (or similar phrases) may also include reduced contact or minimal contact. It should also be understood that unless specifically stated otherwise, references to "a," "an" or "the" may include one or more than one and that reference to an item in the singular may also include the item in the plural. Further, all ranges may include upper and lower values and all ranges and ratio limits disclosed herein may be combined.
    [0015] As a fresh batch of a thermoset adhesive progresses very slowly towards its cured state, all the changes taking place, whether detectable by molecular spectroscopy or not, ultimately lead to changes in the mobility of existing or induced dipoles (atomic or molecular) in the matrix. The origin of these changes may not be limited to formation of chemical bonds: any reorientation of molecular chains, due to relaxation or other reasons, may be a contributing factor. Therefore, probing the material with a technique sensitive to the changes in the average mobility of these dipoles is a promising approach. The methods disclosed herein may be rendered into a standard operating procedure that does not require expert supervision. The present disclosure is based on the realization that by collecting isothermal, complex dielectric permittivity versus frequency data from a resin or prepreg, one can derive essentially all the pertinent information related to changes in atomic, electronic and dipole relaxation properties, which in turn are correlated to what constitutes "early" versus "advanced" curing stages.
    [0016] The complex, isothermal dielectric permittivity of a material exposed to an electric field may be defined as:ε * ω = εʹ ω − i εʺ ω
    [0017] In order to demonstrate a procedure one might use to leverage dielectric spectroscopy for assessing the quality of a nearly-expired or expired thermoset material, a simple case of a material is assumed that can be modeled with a single dipole relaxation time, τm. Its complex, isothermal dielectric constant may be described by the Havriliak-Negami relationship:ε * ω = ε ∞ +ε s − ε ∞ 1 + iωτ mαβ
    [0018] It is evident from this simple model that changes in dipolar relaxation dynamics are reflected into changes in the shape of the curve representing the dielectric permittivity function. By assuming, for example, as the thermoset material becomes more rigid over time, the effective relaxation time decreases; and that materials that exhibit > 9-10% decrease in relaxation time are no longer acceptable. By depicting the changes in the real and imaginary parts of the dielectric permittivity, the surfaces shown in FIGS. 2A and 2B could be viewed as an "acceptability map" 200: for a given sample under consideration, experimental determination of its dielectric permittivity with a simple frequency sweep at isothermal conditions is translated into a % deviation from the baseline "fresh batch" and, in turn, a placement into a band 202 within the acceptability map 200, as represented by the shaded bars 204, which depict a percent deviation from the baseline "fresh batch" ranging from 1-10%. In other words, a given material's experimentally observable dielectric function "signature" is translated into (and may now be visualized as) an objective quality assessment regarding its suitability for further processing. For example, as described further below, the dielectric function of a given material may be experimentally determined. Once determined, the dielectric function of the material is compared against the acceptability map 200. If the percent change of the real or imaginary part of the dielectric function obtained experimentally is greater than, for example, a threshold value equal to 9 or 10% of the comparable values of dielectric function in the acceptability map, then the given material may be determined to have reached an expired state. If less than the threshold value, the given material may be determined to not have reached an expired state and to have a remaining shelf-life.
    [0019] In practice, determination of the frequency-dependent dielectric permittivity may be carried out in either the frequency domain or in the time domain. In the former, the material is subjected to a source signal (typically sinusoidal) and the material's response is detected in a frequency sweep, as outlined above. In the latter, the material is subjected to a step or pulse source signal and the reflected or transmitted signal is detected via a fast sampler. It can be shown that both methods are equivalent, each having pros and cons related to instrumentation, cost, etc. Using the same simple Havriliak-Negami model as the above example, and assuming that a manufacturing plant has determined that the most cost-effective and convenient approach for a certain thermoset is to measure its complex admittance (conductivity) in the frequency domain (e.g., the input signal is a sinusoidal voltage sweep and the output signal is the measured current). The complex conductivity is linked to the complex dielectric permittivity by:σ * ω = i ωε vac ε * ω
    [0020] The admittance of a material may be accessed by reference to either the real part or the imaginary part of the admittance, which are referred to, respectively, as the conductance and the susceptance (both measured in units of seimens). Generally speaking, conductance and susceptance are measures of the ease with which an electrical current passes through a material (e.g., the inverse of electrical resistance). Similar to the discussion of dielectric permittivity above, the admittance of a given material may be experimentally determined. Once determined, the admittance of the material is compared against the acceptability map 300. If the percent change of the real or imaginary part of the admittance obtained experimentally is greater than, for example, a threshold value equal to 9 or 10% of the comparable values of admittance in the acceptability map, then the given material may be determined to have reached an expired state. If less than the threshold value, the given material may be determined to not have reached an expired state and to have a remaining shelf-life.
    [0021] In reality, the complex dielectric permittivity of a thermoset matrix would not be a simple function of a single relaxation time as depicted in equation (2) but rather an unknown function G(τ) that comprises instead a distribution of relaxation times. Hence, for the most general case:ε * ω = ε ∞ + ε s − ε ∞ ∫ 0 ∞ G τ1 + iωτdτ
    [0022] Referring now to FIG. 4, a system 400 for analyzing a state of a thermoset material is illustrated. In various embodiments, the system 400 includes a source of electromagnetic energy 402 (e.g., an emitter) configured to expose a sample 404 of the thermoset material to an electric field. The system 400 further includes a detector 406 configured to determine at least one of a dielectric permittivity or a complex admittance of the sample 404 over a range of frequencies in response to a frequency sweep over the electric field. In various embodiments, the source of electromagnetic energy 402 and the detector 406 may comprise a probe 408 or similar single combined unit that is easily manipulated against a surface of the sample 404. The system 400 further includes a processor 410 and, in various embodiments, an output device 412 (e.g., a computer or mobile device having a screen) configured to provide data to a user, the data being indicative of the state of the thermoset material. The processor 410 is configured to control the system 400, including, for example, operation of the source of electromagnetic energy 402 and the detector 406.
    [0023] In various embodiments, the processor 410 includes one or more memories 414 (e.g., tangible, non-transitory memories) capable of implementing digital or programmatic logic. In various embodiments, for example, the processor 410 comprises one or more of a general purpose processor, a digital signal processor (DSP), an application specific integrated circuit (ASIC), a field programmable gate array (FPGA), or other programmable logic device, discrete gate, transistor logic, or discrete hardware components, or any various combinations thereof. The one or more memories 414 is configured to store instructions that are implemented by the processor 410 for performing various functions. The memories may also be configured to store one or more acceptability maps, such as the acceptability maps described above with reference to FIGS. 2A, 2B, 3A and 3B. The processor 410 may further include hardware 416 capable of performing various logic using data received from the detector 406 or the probe 408. For example, an analyzer 418 or similar hardware is configured to assess the state of the thermoset material by comparing the at least one of the dielectric permittivity or the complex admittance of the sample 404 against an acceptability map, such as one of the acceptability maps described above with reference to FIGS. 2A, 2B, 3A and 3B.
    [0024] Referring now to FIG. 5, a method 500 of analyzing a state of a thermoset material is described as comprising the following steps. A first step 502 includes exposing a sample of the thermoset material to an electric field. A second step 504 includes performing a frequency sweep to determine one or more of a dielectric permittivity or a complex admittance of the sample over a range of frequencies. A third step 506 includes assessing the state of the thermoset material by comparing the dielectric permittivity or the complex admittance of the sample against an acceptability map. In various embodiments, the acceptability map comprises a series of acceptability bands that represent a decrease in an effective relaxation time from a baseline fresh batch of the thermoset material. In various embodiments, the acceptability map includes a series of acceptability bands that represent a decrease in effective relaxation time from a baseline fresh batch of the thermoset material. The series of acceptability bands comprises one or both of a real part and an imaginary part of the dielectric permittivity or the complex admittance. In various embodiments, the electric field comprises a sinusoidal source signal or a pulse source signal. In various embodiments, the frequency sweep is performed at an isothermal condition. In various embodiments, the method is configured to assess the state of a prepreg material, a resin or an adhesive.
    [0025] Benefits, other advantages, and solutions to problems have been described herein with regard to specific embodiments. Furthermore, the connecting lines shown in the various figures contained herein are intended to represent exemplary functional relationships or physical couplings between the various elements. It should be noted that many alternative or additional functional relationships or physical connections may be present in a practical system. However, the benefits, advantages, solutions to problems, and any elements that may cause any benefit, advantage, or solution to occur or become more pronounced are not to be construed as critical, required, or essential features or elements of the disclosure. The scope of the disclosure is accordingly to be limited by nothing other than the appended claims, in which reference to an element in the singular is not intended to mean "one and only one" unless explicitly so stated, but rather "one or more." Moreover, where a phrase similar to "at least one of A, B, or C" is used in the claims, it is intended that the phrase be interpreted to mean that A alone may be present in an embodiment, B alone may be present in an embodiment, C alone may be present in an embodiment, or that any combination of the elements A, B and C may be present in a single embodiment; for example, A and B, A and C, B and C, or A and B and C. Different cross-hatching is used throughout the figures to denote different parts but not necessarily to denote the same or different materials.
    [0026] Systems, methods and apparatus are provided herein. In the detailed description herein, references to "one embodiment," "an embodiment," "various embodiments," etc., indicate that the embodiment described may include a particular feature, structure, or characteristic, but every embodiment may not necessarily include the particular feature, structure, or characteristic. Moreover, such phrases are not necessarily referring to the same embodiment. Further, when a particular feature, structure, or characteristic is described in connection with an embodiment, it is submitted that it is within the knowledge of one skilled in the art to affect such feature, structure, or characteristic in connection with other embodiments whether or not explicitly described. After reading the description, it will be apparent to one skilled in the relevant art(s) how to implement the disclosure in alternative embodiments.
    [0027] Furthermore, no element, component, or method step in the present disclosure is intended to be dedicated to the public regardless of whether the element, component, or method step is explicitly recited in the claims. As used herein, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
    [0028] Finally, it should be understood that any of the above described concepts can be used alone or in combination with any or all of the other above described concepts. Although various embodiments have been disclosed and described, one of ordinary skill in this art would recognize that certain modifications would come within the scope of this disclosure. Accordingly, the description is not intended to be exhaustive or to limit the principles described or illustrated herein to any precise form. Many modifications and variations are possible in light of the above teaching.
    权利要求:
    Claims (12)
    [0001] A method of analyzing a state of a thermoset material, comprising:
    exposing a sample of the thermoset material to an electric field;
    performing a frequency sweep to determine at least one of a dielectric permittivity or a complex admittance of the sample over a range of frequencies; and
    assessing the state of the thermoset material by comparing the at least one of the dielectric permittivity or the complex admittance of the sample against an acceptability map.
    [0002] The method of claim 1, wherein the acceptability map comprises a series of acceptability bands.
    [0003] The method of claim 2, wherein the series of acceptability bands represents a decrease in effective relaxation time from a baseline fresh batch of the thermoset material.
    [0004] The method of claim 2 or 3, wherein the series of acceptability bands comprises a real part of the at least one of the dielectric permittivity or the complex admittance.
    [0005] The method of claim 2, 3 or 4, wherein the series of acceptability bands comprises an imaginary part of the at least one of the dielectric permittivity or the complex admittance.
    [0006] The method of any preceding claim, wherein the electric field comprises a sinusoidal source signal.
    [0007] The method of any of claims 1 to 5, wherein the electric field comprises a pulse source signal.
    [0008] The method of any preceding claim, wherein the frequency sweep is performed at an isothermal condition.
    [0009] The method of any preceding claim, wherein the thermoset material is a prepreg material.
    [0010] The method of any preceding claim and for analyzing a state of a thermoset material via a processor, wherein:
    the exposing step is exposing, via an emitter, a sample of the thermoset material to an electric field, the emitter being controlled by the processor;
    the performing step is performing, via a detector, a frequency sweep to determine at least one of a dielectric permittivity or a complex admittance of the sample over a range of frequencies, the detector being controlled by the processor; and
    the assessing step is assessing, via the processor, the state of the thermoset material by comparing the at least one of the dielectric permittivity or the complex admittance of the sample against an acceptability map.
    [0011] A system for analyzing a state of a thermoset material, comprising:
    a source of electromagnetic energy configured to expose a sample of the thermoset material to an electric field;
    a detector configured to determine at least one of a dielectric permittivity or a complex admittance of the sample over a range of frequencies in response to a frequency sweep over the electric field; and
    an analyzer configured to assess the state of the thermoset material by comparing the at least one of the dielectric permittivity or the complex admittance of the sample against an acceptability map.
    [0012] The system of claim 11, wherein the acceptability map comprises a series of acceptability bands that represent a decrease in effective relaxation time from a baseline fresh batch of the thermoset material.
    类似技术:
    公开号 | 公开日 | 专利标题
    Raveri2016|Are cosmological data sets consistent with each other within the Λ cold dark matter model?
    Au2014|Uncertainty law in ambient modal identification—Part I: Theory
    Dulieu-Barton et al.1998|Development and applications of thermoelastic stress analysis
    US20180266974A1|2018-09-20|Method and system for non-destructive testing
    US6359441B1|2002-03-19|Electronic battery tester
    Vassilikou-Dova et al.2009|Dielectric analysis |
    US9201120B2|2015-12-01|Electronic battery tester for testing storage battery
    West et al.1997|Characterization of electrical materials, especially ferroelectrics, by impedance spectroscopy
    US6204670B1|2001-03-20|Process and instrument for moisture measurement
    Dziendzikowski et al.2016|In situ Barely Visible Impact Damage detection and localization for composite structures using surface mounted and embedded PZT transducers: A comparative study
    US9903781B2|2018-02-27|Material testing apparatus and method
    Trabelsi et al.2000|Phase-shift ambiguity in microwave dielectric properties measurements
    Omar et al.2008|A quantitative review of three flash thermography processing routines
    US7174255B2|2007-02-06|Self-processing integrated damage assessment sensor for structural health monitoring
    Chung2007|Damage detection using self-sensing concepts
    JP4022474B2|2007-12-19|Method and apparatus for non-destructive measurement and mapping of sheet material
    US20110112775A1|2011-05-12|Method and device for monitoring an aircraft structure
    US8449176B2|2013-05-28|Automated binary processing of thermographic sequence data
    CA2397102C|2012-05-29|Direct thermal conductivity measurement technique
    JP2013504037A|2013-02-04|Advance manufacturing monitoring and diagnostic tools
    Mdarhri et al.2007|Microwave dielectric properties of carbon black filled polymers under uniaxial tension
    Qin et al.2008|Monitoring of cement hydration using embedded piezoelectric transducers
    CN102749558A|2012-10-24|Device and method for detecting cable oscillatory wave partial discharge and fault location
    Zhang et al.2016|Identification and characterisation of steel corrosion using passive high frequency RFID sensors
    Urquidi-Macdonald et al.1990|Applications of Kramers—Kronig transforms in the analysis of electrochemical impedance data—III. Stability and linearity
    同族专利:
    公开号 | 公开日
    引用文献:
    公开号 | 申请日 | 公开日 | 申请人 | 专利标题
    法律状态:
    2020-06-26| PUAI| Public reference made under article 153(3) epc to a published international application that has entered the european phase|Free format text: ORIGINAL CODE: 0009012 |
    2020-06-26| STAA| Information on the status of an ep patent application or granted ep patent|Free format text: STATUS: THE APPLICATION HAS BEEN PUBLISHED |
    2020-07-29| AK| Designated contracting states|Kind code of ref document: A1 Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR |
    2021-02-05| STAA| Information on the status of an ep patent application or granted ep patent|Free format text: STATUS: REQUEST FOR EXAMINATION WAS MADE |
    2021-03-10| 17P| Request for examination filed|Effective date: 20210129 |
    2021-03-10| RBV| Designated contracting states (corrected)|Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR |
    优先权:
    申请号 | 申请日 | 专利标题
    [返回顶部]